eMMC 153 ball

FLEXXON’s eMMC 153 ball is fully comply with JEDEC eMMC 5.1 Standard. It supports standard 153-FBGA package design.

eMMC 153 ball provides high performance, good reliability and advanced power management. It is suitable for small, low power electronic devices.

eMMC 5.1 Storage

eMMC 153 ball - Features

tailor made firmware
Tailor-made Firmware
highly Integrated eMMC Solution
Highly Integrated eMMC Solution
Package Design
Package Design
eMMC SeriesECON IIXTRA VIIXTRA VIIIAXOAXO
Pin Count-153 Ball153 Ball100 Ball153 Ball
Interface eMMC 5.1 / 4.x eMMC 5.1 / 4.x eMMC 5.1 / 4.x eMMC 5.1 eMMC 5.1
Flash typeMLC, 3D TLC3D TLC, 3D pSLC3D TLC, 3D pSLC3D TLC3D TLC
Capacity
3D TLC32GB ~ 128GB16GB ~ 128GB16GB ~ 128GB64GB ~ 512GB64GB ~ 512GB
3D pSLCNA8GB ~ 32GB8GB ~ 32GBNANA
MLC4GB ~ 16GBNANANANA
Max.Performance
Read 270 MB/s 310 MB/s 320 MB/s 300 MB/s 300 MB/s
Write120 MB/s210 MB/s260 MB/s200 MB/s200 MB/s
Operating TemperatureCommercial Grade (-25C-85C)Industrial Diamond (-40C-85C)Automotive grade 3 (-40C-85C) Automotive grade 2 (-40C-105C)Industrial Gold (-25C-85C)
Industrial Diamond (-40C-85C)
Automotive grade 3 (-40C-85C)
Automotive grade 2 (-40C-105C)
Industrial Gold (-25C-85C)
Industrial Diamond (-40C-85C)
Automotive grade 3 (-40C-85C)
Automotive grade 2 (-40C-105C)
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